66 -- INSTRUMENTS AND LABORATORY EQUIPMENT

Notice Date

June 12, 2001

Contracting Office

Bid Office, SPAWARSYSCEN, Code D21B, 53570 Silvergate Avenue, Bldg. A33, Room 0061, San Diego, CA 92152-5112

ZIP Code

92152-5112

Solicitation Number

N/A

Response Due

June 26, 2001

Point of Contact

Roger E. Haag; (619) 553-7734 CONTRACT SPECIALIST

E-Mail Address

Click here to contact the contract specialist via (rhaag@spawar.navy.mil)

Description

This is a synopsis prepared in accordance with FAR Part 13. No RFQ will be prepared or made available for distribution; award will be made on a sole-source basis. The government intends to award, on a Sole Source basis, an order to FSI International, the following item: Item 1: Wafer Surface Conditioning System; Description: Configured to use 150mm silicon wafers; configured for Fluoroware A190-60M-0215 low profile cassettes; configured for typical FSI "B" cleans; configured to conduct photoresist stripping; configured to conduct sidewall polymer removal; conforms to FSI's "Mercury MP Spray Processing System Machine Specifications"; contains a clean-room and level floor; must not exceed the following dimensions: back to front dimension of 45 inches, process console is no wider than 60 inches, electronics console is no wider than 36 inches; two chemical consoles; chemical consoles not to exceed the following specifications: 25 inches in width, 45 inches in depth, 36 inches in height; includes in-line IR chemical heating for all chemicals; cabinet material must be Fire Retardant Polypropylene or equivalent; includes dual canisters for H2O2; chemical inputs and flow ranges are as follows: 50:1HF 500-1800cc/min, NH4OH 30-300cc/min, HC1 30-300cc/min, H2O2 30-300cc/min, H2S04 600-800cc/min, de-ionized water mix; chemical flow streams must use Millipore filters; dual exhaust ducting; chemical feed-lines must be sufficient to allow for canister consoles to be placed 15-20 ft from process console on same level floor in chase; concentrated waste drain; chemical canisters configured for manual fill; FSI HELIOS for DI water heating with 480V 3-Phase 60Hz; FSI DI water booster pumping with 208V single-phase 60Hz; includes one HELIOS spares kit and one IR Heater spares kit; cabinet drip tray for each cabinet; component rinse valve for manual rinsing and purging; contractor must install system; three-year warranty to include parts and labor; after installation, system must perform at FSI's 503289-0001 Rev. "F" specifications in order for the government to accept item. Questions may be directed to Roger Haag via email: rhaag@spawar.navy.mil all offers received within 15 days (in lieu of 45 days) after date of publication of this synopsis will be considered by the government. See numbered notes from any Monday Edition of the CBD. The applicable North American Industry Classification Code is: 333295, Wafer Processing Equipment, Semiconductor, Manufacturing. The full text of the Federal Acquisition Regulation (FAR) can be accessed on the Internet at http://farsite.hill.af.mil/. Offerors must complete and submit with their quote, a copy of 52.219-1 Alt I/II, Small Business Program Representations. Central Contractor Registration is required. Information may be found at http://www.ccr2000.com/.

Record

Loren Data Corp. 20010614/66SOL011.HTM (W-163 SN50O6X8)