70 -- MEMS SOFTWARE PACKAGE

Notice Date

July 26, 2001

Contracting Office

DOE/National Energy Technology Laboratory, P.O. Box 10940, MS 921-107, Pittsburgh, PA 15236-0940

ZIP Code

15236-0940

Solicitation Number

S0100655

Response Due

August 17, 2001

Point of Contact

Technical Representative, Mr. Harold Pratt, 304-285-4245, Contracting Officer, Mr. Robert L. Mohn, 412-386-4963

E-Mail Address

mohn@netl.doe.gov (mohn@netl.doe.gov)

Description

DESC: This is a combined synopsis/solicitation for commercial items prepared in accordance with the format in FAR Subpart 13.5, as supplemented with additional information included in this notice. This solicitation number S0100655 is issued as a Request for Quote (RFQ). Proposals are due August 17, 2001. This requirement is being issued as a Request for Quotation using Simplified Acquisition Procedures. The following items are to be purchased by the U.S. Department of Energy's National Energy Technology Laboratory (NETL), Pittsburgh, PA and is to be shipped to our site located in Morgantown, WV. A MEMS Software Package to design and simulate a microfluidic active microvalve as well as future MEMS devices which will include various sensors and actuators which must operate in extreme environments seen in energy systems or equivalent. The software must meet the following specifications and salient features. A. (1) Incorporate micro-fluidics design/analysis as well as the ability to include smart materials (shape memory alloy, piezoelectric materials). (2) Provide the capability to simulate DRIE and wet chemical etching processes, which appear to be pretty standard in most packages. (3) Provide 3-dimensional solid simulation of the final device based on a multi-layer mask file and process table is also desirable in order to prevent dysfunctional MEMS devices. (4) Since there are already good packages which perform stress or electrical analysis, the MEMS software should export models to be analyzed by ANSYS (FEA) for mechanical, thermal, and fluidics analysis or PSPICE to simulate electrical performance. (5) Have the widest possible range of MEMS material (thin film properties) database and MEMS fabrication process simulations. (6) Provide MEMS component schematic layout and capture, mask design, simulation of various etching and deposition processes -- including ones that are germane to specific MEMS foundries in the U.S., full multi-physics simulation, production of solid models and meshing with export for FEA and performance analysis. (7) Provide Mask layout editor that can produce multi-layered mask files for import into DXF or GDSII compatible systems. (8) Anisotropic etching simulation with different anisotropic etchants. (9) Predicts the effects of etchant temperature, concentrations and time on final geometry. (10) Corner compensation and process tolerances can be modeled. (11) Creates a meshed structure automatically user can create the mesh or import from ANSYS, ABAQUS or PATRAN file formats. B. General Analysis Features: (1) Linear and non-linear analysis. (2) Static, steady state, and transient analysis. (3) Fully 3D coupled dynamics analysis. (4) Parametric variation of parameters. (5) Takes into account fabrication process-induced effects. (6) Submodeling, symmetry, and other size reducing techniques. (7) Animation and color mapping of results and (7) Export and import to/from other engineering CAD tools. C. Electrostatic, ThermoMechanical, and fully 3D coupled ThermoElectroMechanical: (1) Displacement due to voltage and thermal loading. (2) Capacitance due to voltage and thermal deformation. (3) Pull-in voltage, contact and hysteresis loop calculations. (4) Full multi-dielectric capabilities. (5) Stress, temperature, potential, charge, and pressure distribution., (6) Joule/resistive heating actuation. (7) Assembly and latching analysis. (8) Post-assembly coupled analysis. (9) Natural frequency and mode shapes as a function of loading and (10) Heat transfer: radiation, conduction, and convection. D. Piezoelectric and Piezoresistive. (1) Displacement and deformation due to voltage loading. (2) Natural frequency and mode shapes as a function of loading and (3) Stress distribution. E. Electromagnetic-Mechanical. (1) Impedance matrix, inductance, and force distribution calculations. (2) Low frequency electromagnetic actuation. (3) High and low frequencies EM simulation of packaging delay and cross-talk. (4) High and low frequencies EM simulation of micro-antennas and micro-motors and (5) High frequency electromagnetic simulation of RF devices S-parameter extraction. F. 3D Fluid-Thermo-Mechanical. (1) Transient squeeze-film damping (with thermal/electrical actuation). (2) Microchannel fluid flow, micromixing chambers, and micro heat exchangers. (3) 3D Multi-phase flow with moving interfaces. (4) 3D Fluid-structure interaction with deformable structures and (5) Membrane pumps, flapper valves, etc. DELIVERY: Equipment must be received no later than September 30, 2001 and FOB Destination is required (all freight included). FAR 52.212-1 Instructions to Offerors -- Commercial Items (AUG 1998) is incorporated by reference and applies to this acquisition. Within FAR 52.212-1, an reference to "offer" is changed to read as "quote". The provisions at 52.212-2 Evaluation -- Commercial Items (JAN 1999) does not apply to this acquisition. Instead, the following information will be used for evaluation of offerors: An award shall be made to the responsible offeror submitting a technically acceptable quote and offering the lowest evaluated price. Evaluation is based on best value including cost and ability to meet stated requirements above. Offerors shall submit descriptive literature and drawings detailing features, technical capabilities and warranty data. Technical acceptability will be determined solely on the content and merit of the information submitted response to this provision as it compares to the minimum characteristics provided above. Therefore, it is essential that offerors provide sufficient technical literature, documentation, etc., in order for the Government evaluation team to make an adequate technical assessment of the quote as meeting technical acceptability. Price shall be the deciding factor among technically acceptable quotes. The offeror shall provide backup information to support the quoted prices (e.g. a copy of current catalog or established price list, etc.). FAR 52.212-3 Offeror Representation and Certifications -- Commercial Items, FAR 52.214-4 Contract Terms and Conditions -- Commercial Items, and FAR 52.2121-5 Contract Terms and Conditions Required to implement Statutes or Executive Orders -- Commercial Items apply to this acquisition. FAR provisions and clauses including FAR 52.222-37, Employment Reports on Disabled Veterans and Veterans of the Vietnam ERA, it has ( ), has not( ) submitted the most recent report required by 38 U.S.C. 4212(d). (B) An Offeror who checks "has not" may not be awarded a contract until the required reports are filed. (31 U.S.C. 1354). ALL INTERESTED PARTIES SHALL SUBMIT OFFERS WITH THE FOLLOWING INFORMATION: Federal Tax Identification (TIN); Dun & Bradstreet Number (DUNS); remit to address if different; and business size. EVALUATION: The following factors shall be used to evaluate offers in order or precedence: Technical compliance with the specifications of this RFQ and cost. 52.212-3, Offeror Representation and Certifications -- Commercial Items; and 52.212-4, Contract Terms and Conditions. A Firm Fixed Priced Purchase Order shall be issued using the Simplified Acquisition Procedures FAR Part 13. Anticipated award will be on or about August 27, 2001. Proposals may be faxed to Mr. Robert L. Mohn, 412-386-5770.

Record

Loren Data Corp. 20010730/70SOL003.HTM (W-207 SN50T0P1)