A -- VERTICALLY INTERCONNECTED SENSOR ARRAYS (VISA)

Notice Date

October 25, 2001

Contracting Office

Other Defense Agencies, Defense Advanced Research Projects Agency, Contracts Management Office, 3701 North Fairfax Drive, Arlington, VA, 22203-1714

ZIP Code

22203-1714

Solicitation Number

BAA02-05

Response Due

January 22, 2002

Point of Contact

James Murphy, DARPA Program Manager, Phone 000-000-0000, Fax 703-696-2206, Email none

Description

DARPA is soliciting innovative research proposals in the area of three-dimensional readout architectures and circuits for imaging focal plane staring arrays used in military systems. Specific interest is in the development and implementation of massively parallel, densely interconnected imaging focal plane architectures. This is expected to result in the achievement (separately or in concert) of high resolution, high fill-factor pixels, ultra-wide dynamic range (greater than 20 bits), multispectral, and very fast imaging capabilities. The program will address pressing Service needs which include imaging dim targets in the presence of high backgrounds, countering laser jamming, and defeating camouflage, concealment, and deception. DARPA seeks innovative proposals in the following areas: (1) Process technology for dense interconnects (electrical or optical) through three-dimensional structures including via generation, wafer bonding, and thermal management. The ability to demount and repair stacks may be important; (2) Novel circuitry that capitalizes on direct connection to the detectors so as to achieve adaptive signal processing heretofore impossible; (3) Demonstration of imaging focal plane arrays (FPAs) based on (1) and (2) that address new military problems; (4) Novel imager architectures which exploit densely interconnected, very high speed circuitry, and (5) Studies which identify optimal defense applications and extensions of the 3D FPA technologies described in (1)-(4) above. Additional information on these technology areas is provided in the Areas of Interest section of the BAA 02-05 Proposer Information Pamphlet referenced below. Depending on the results achieved in this Phase, further research into the technology areas described above and directed at specific Defense applications may be supported at a future date. AREAS OF INTEREST: The VISA program will consist of five main thrusts- I. Process Technology for Dense Focal Plane Interconnections; II. Novel Pixel Readout Circuits; III. 3D Integrated Focal Plane Technology Demonstrations; IV. 3D Focal Plane Architectures and Readout Technologies; and V. 3D Focal Plane Array Applications Study. Additional information on these technology areas is provided in the Areas of Interest section of the BAA 02-05 Proposer Information Pamphlet referenced below. PROGRAM SCOPE: Awards totaling approximately $35 million over four years are expected to be made during the first half of calendar year 2002. Multiple awards are anticipated. Collaborative efforts/teaming are strongly encouraged. The program will also support some very innovative individual investigator efforts as well. Cost sharing is not required and is not an evaluation criterion, but is encouraged where there is a reasonable probability of a potential commercial application related to the proposed research and development effort. The technical POC for this effort is Dr. James D. Murphy, fax: (703) 696-2206, electronic mail: jmurphy@darpa.mil. GENERAL INFORMATION: Proposers must obtain a pamphlet entitled BAA 02-05, Vertically Interconnected Sensor Arrays (VISA), Proposer Information Pamphlet which provides further information on vertically interconnected imaging sensor arrays, the submission, evaluation, and funding processes, proposal abstract formats, proposal formats, and other general information. This pamphlet may be obtained from the FedBizOpps website: http//www.fedbizopps.gov, the World Wide Web (WWW), by fax, electronic mail, or mail request to the administrative contact address given below. Proposals not meeting the format described in the pamphlet may not be reviewed. In order to minimize unnecessary effort in proposal preparation and review, proposers are strongly encouraged to submit proposal abstracts in advance of full proposals. An original and nine (9) copies of the proposal abstract must be submitted to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn.: BAA 02-05) on or before 4:00 p.m., local time, Thursday, November 29, 2001. Proposal abstracts received after this time and date may not be reviewed. Upon review, DARPA will provide written feedback on the likelihood of a full proposal being selected and the time and date for submission of a full proposal. Proposers not submitting proposal abstracts must submit an original and nine (9) copies of the full proposal to DARPA/MTO, 3701 North Fairfax Drive, Arlington, VA 22203-1714 (Attn: BAA 02-05) on or before 4:00 p.m., local time, Tuesday, January 22, 2002, in order to be considered. This notice, in conjunction with the BAA 02-05 Proposer Information Pamphlet, constitutes the total BAA. No additional information is available, nor will a formal RFP or other solicitation regarding this announcement be issued. Requests for the same will be disregarded. The Government reserves the right to select for award all, some, or none of the proposals received. All responsible sources capable of satisfying the Government's needs may submit a proposal which shall be considered by DARPA. Historically Black Colleges and Universities (HBCUs) and Minority Institutions (MIs) are encouraged to submit proposals and join others in submitting proposals; however, no portion of this BAA will be set aside for HBCU and MI participation due to the impracticality of reserving discrete or severable areas of research in description. All administrative correspondence and questions on this solicitation, including requests for information on how to submit a proposal abstract or full proposal to this BAA, should be directed to one of the administrative addresses below; e-mail or fax is preferred. DARPA intends to use electronic mail and fax for correspondence regarding BAA 02-05. Proposals and proposal abstracts may not be submitted by fax or e-mail; any so sent will be disregarded. DARPA encourages use of the WWW for retrieving the Proposer Information Pamphlet and any other related information that may subsequently be provided. EVALUATION CRITERIA / EVALUATION AND FUNDING PROCESSES: Proposals will not be evaluated against each other since they are not submitted in accordance with a common work statement. DARPA's intent is to review proposals as soon as possible after they arrive; however, proposals may be reviewed periodically for administrative reasons. Evaluation of proposal abstracts and full proposals will be accomplished through a technical review of each proposal using the following criteria, which are listed in descending order of relative importance: (1) overall scientific and technical merit, (2) potential contribution and relevance to DARPA mission, (3) plans and capability to accomplish technology transition, (4) offeror's capabilities and related experience, and (5) cost realism. Note: cost realism will only be significant in proposals which have significantly under or over-estimated the cost to complete their effort. The administrative addresses for this BAA are: Fax: (703) 696-2206 (Addressed to: DARPA/MTO, BAA 02-05), Electronic Mail: BAA02-05@darpa.mil, Mail: DARPA/MTO, ATTN: BAA 02-05, 3701 North Fairfax Drive, Arlington, VA 22203-1714. This announcement and the Proposer Information Pamphlet may be retrieved via the WWW at URL http://www.darpa.mil/ in the solicitations area.

Web Link

Visit this URL for the latest information about this (http://www.eps.gov/spg/ODA/DARPA/CMO/BAA02-05/listing.html)

Record

Loren Data Corp. 20011029/ASOL005.HTM (D-298 SN5115N2)